On Sat, Jul 5, 2008 at 2:24 PM, Mag Gam <
magawake@gmail.com> wrote:
>
> Thanks for the responses.
>
> What is the engineering challenge of having more memory in a single die? I expect latency would be a issue. Also, as Brad mentioned greater risk of failure.
>
> Any thing else?
>
>
>
> On Fri, Jul 4, 2008 at 11:04 AM, <
owens@netptc.net> wrote:
>>
>> >
>> >
>> >
>> >---- Original Message ----
>> >From:
magawake@gmail.com
>> >To:
debian-user@lists.debian.org
>> >Subject: RE: memory question (hardware)
>> >Date: Thu, 3 Jul 2008 01:08:10 -0400
>> >
>> >>I am curious...
>> >>
>> >>
>> >>When memory is manufactured why does a stick of 4GB memory cost 2.5
>> >times of
>> >>2GB memory? Is the manufacturing process that much different to
>> >justify the
>> >>cost?
>>
>> Obviously we can't open up the sticks and look at the chips, but the
>> usual answer is that the 2G used "the older" technology and the 4G
>> used the "newer" technology and the chip vendor is trying to recoup
>> development costs. As the "newer" technology becomes the "older"
>> technology the cost will go down. With Moore's "law" this gives the
>> chip vendor about 18 months to recoup most of the development costs
>> and some profit.
>> Larry
>> >>
>>
>>
>>
>