hi ya jacob
On Sat, 30 Aug 2003, Jacob Anawalt wrote:
Just an aside. I realize the VIA chip's virtue is in it's power
consumption thus low heat but if you're into the high-heat chips for
some fpu intensive work like the 1.2Ghz listed above, have you seen
Shuttle's I.C.E. (heatpipe) cooling?
http://us.shuttle.com/specs_access.asp?pro_id=269
I have a Shuttle XPC with an Athlon 1800+. It is is cooled by their
heatpipe system. A big block sits ontop of the CPU with some metal tubes
going up to a mini-radiator assembly with a variable speed fan.
we have 13 shuttle's w/ P4-2.8 ... and those puppies are super hot
- the case itself is hot too where the exhaust is supposedly
comeing out
leave the cover off the shuttle and the cpu exhaust and case is nice cool
-- ie ... air can circulate around the cpu and exhaust fans
the radiator is a poorly designed cooling system
and due to size, there is no way to add additional fans to cool the cpu
and i'm recommending all systems get a seperate 40x40x20mm mounted
sideways to cool the 1GB memory chips ( runs too too hot )
- random machines crashing ... at random points ..
and if there's a choice... to avoid buying any shuttles w/ 2.8 or faster
until that cooling is solved without use tweeking the cooling methodology
while the other 12-30 shuttles w/ p4-2.4 works fine .. and no hot
cpu exhaust air out its back
- the bigger the metal ... the hotter it will become and the harder
it will be for the itty-bitty fan to cool the block of metal
and since it has no fins ... other than silly 0.1" dia heat pipes,
there is very little thermal conduction/thermal conductivity
-- a simple finned block on the cpu with the heatpipes
would work an order of magnitude better ..
-- wish i had a big gian lathe/mill to cut that block of
heatsink apart but than again its not my PCs :-)
c ya
alvin