New Adhesives Technology Book
Coming soon from William Andrew Publishing, a comprehensive coverage of all aspects of adhesive technology
for electronic devices and packaging, from theory to bonding to test procedures. Order now (prepublication) and
save 15%.
Adhesives Technology for Electronic Applications
©2005 (August), James Licari and Dale Swanson
http://www.williamandrew.com/books.asp?id=1513
In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book includes
new developments in anisotropic, electrically conductive, and underfill adhesives. Rapid curing methods such as
UV, microwave, and moisture (which comply with current environmental and energy requirements) are covered.
Over 80 tables and 120 figures provide a wealth of data on properties, performance, and reliability. Also included
are examples of commercially available adhesives, suppliers, and equipment. Each chapter provides comprehensive
references.
If you have specific questions about this title, please contact Brent Beckley by email at
brent.beckley@williamandrew.com.
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